Liquid cooling is the fastest-growing segment in the market—and where DATAGREEN is driving innovation
iD2C – Intelligent Direct Efficient Chip Liquid Cooling for CPU and GPU
Intelligent Direct-to-Chip Cooling: 50% More Capacity, Zero Compromise
DataGreen’s iD2C system redefines what direct cooling can achieve. Our intelligent architecture delivers 50% greater cooling capacity than conventional D2C solutions—enabling unprecedented datacenter density and performance.
While others cool processors, we unlock their full potential. Support next-generation AI workloads, eliminate thermal bottlenecks, and future-proof your infrastructure with cooling technology that adapts as fast as your compute demands evolve.
The result: Higher density. Lower operational costs. Maximum performance without thermal limits.
DataGreen iD2C—cooling evolved.
DTG 3XS – Ultra-Efficient Micro Data Centers
Compact, high-performance insulated enclosures supporting up to 36 GPUs per box.- Dust-Free, AC-Free: Advanced passive and active cooling—no air conditioning needed.
- Waste Heat Recovery: Built-in system captures and repurposes excess heat.
- Plug & Play Efficiency: Fully integrated, self-contained units for rapid deployment.
DTG 2XL Workstation
A next-generation workstation built for workgroups and high-demand standalone environments.
- Extreme Scalability: Supports up to 8 GPUs and 2 CPUs (up to 4.5 kW total compute)
- Liquid-First Architecture: Cooling is central to the design—not an afterthought
- Compact & Powerful: High-density chassis delivers datacenter-grade performance in a workstation footprint
- Whisper-Quiet Operation: Acoustically optimized for quiet performance (even with 4 GPUs)
- Built for Reliability: Redundant power supplies and industrial-grade components
- Perfect for AI, VFX, Virtual Production, and Simulation
DTG 2XL Server
Flexible Compute Node – Server-Grade Versatility
Precision Engineering for Workgroups, Studios, and Retrofit Integration
Built for demanding compute workflows and seamless retrofitting into existing infrastructure, the DTG 2XL Server offers unmatched versatility and raw performance in a compact, liquid-cooled enclosure.
- Up to 8 GPUs & 2 CPUs – Supports up to 4.5 kW total compute power
- Liquid-Cooling First Architecture – Engineered from the ground up for efficient thermal management
- Modular Deployment – Use standalone, as a workstation, or rack-integrated for retrofit server environments
- Ultra-Compact, High-Density Design – Delivers maximum performance per cubic inch
- Quiet Operation – Acoustic optimization for low noise
- Industrial Reliability – Redundant power supply and premium build quality
- Future-Ready – Designed with headroom for next-gen GPUs
DTG 2XL Server – Extreme Compute, Flexible Integration.
DTG 2XS – Rugged Edge GPU Node
Compact, Insulated Enclosure for Harsh Environments
The DTG 2XS is a high-performance, GPU-dense solution designed for edge computing in challenging conditions. Engineered to operate reliably in environments with dust, sand, humidity, and temperature fluctuations, it delivers powerful compute where traditional data centers can’t.
- Supports 6–8 GPUs in a compact, insulated chassis
- Dust, Sand & Humidity Proof – Fully sealed for harsh and remote deployment
- Ideal for Edge AI, On-Site Rendering, and Tactical Compute
- Passive & Active Thermal Management – Reliable performance without AC dependence
- Deploy Anywhere – Industrial-grade durability for on-location or mobile use
DTG 2XS – Bring the Power to the Edge.
DTG MOBILE
– High-Density Liquid-Cooled Mobile Data Center
Scalable. Efficient. Ready Anywhere.
DTG MOBILE is a fully integrated, high-performance data center built into a mobile platform. Designed for rapid deployment and extreme density, with advanced iD2C liquid cooling and waste heat recovery, maximizing energy efficiency wherever it’s needed.
- Fully Integrated Infrastructure: Power distribution, liquid cooling, heat exchangers, pumps, automation & control
- Waste Heat Recuperation for sustainable thermal management
- Turnkey Deployment: Engineered for edge, industrial, HPC, emergency compute scenarios, broadcasting, civil and military drones control
- High Density, Low Footprint: Optimized for maximum compute per square meter
DTG MOBILE – Data Center Power. Wherever You Need It.
OEM/ODM by DataGreen
End-to-End Integration for High-Performance Computing Systems
DataGreen offers complete OEM/ODM services tailored to vendors seeking advanced system integration with a focus on liquid-cooled, high-density compute solutions. From concept to deployment, we handle every stage with precision, speed, and quality.
Our Full-Service Includes:
- Design & Prototyping
- Validation & Testing
- Mass Production & Assembly
- Quality Assurance & Certification
- Installation & On-Site Support
- Precision-built for AI, HPC, and data center integration
DataGreen OEM/ODM – Precision Integration. Scalable Performance
